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The Chamber Maintenance Wafer (CMW) effectively reduces downtime associated with tool errors due to particulates deposited on electrostatic and vacuum chucks used on semiconductor processing equipment. The CMW consists of a polymer film deposited on a silicon wafer, and is processed film-side down in situ. Usable multiple times, the polymer film is effective in greatly reducing metallic contamination of the chuck surface and safely removing contaminants from the chuck and handling surfaces. The CMW has been successfully tested on photolithography scanners as well as HDP-CVD, etch, implant, wafer inspection systems, and PVD tools.
- Shorter green-to-green time for preventive maintenance procedures
- Fixes backside pressure faults
- Metallic contamination reduction
- Resolves “hot spot” problems found in photolithography steppers / scanners
- Faster tool startup after installation
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